PCBPanel Cutting Machine for PCB
Shears copper-clad laminate to panel size before drilling, with square edges for downstream registration.
- Panel up to 24 × 24 in
- CCL / FR-4 / CEM
- Square-cut, low burr
PCB process lines · wafer & chip tools
Boards and wafers
on one line.
CNC and laser drilling, LDI, DES, plating, AOI and solder-mask lines for PCB. CZ furnaces, lithography, PVD, lapping and plasma etch for front-end chip work. Quoted against your process window.
19catalogue machines
2process families
1 dayquote response
Equipment range
PCB and CHIP catalogue
Process equipment sourced for printed-circuit fabrication and front-end wafer / chip lines. Send panel size, wafer diameter and process window for a firm quote.
PCB
PCBCNC PCB Drilling Machine
Multi-spindle CNC drilling for through-holes and tooling holes on rigid and multilayer panels.
- Hole Ø 0.1–6.35 mm
- Multi-spindle gantry
- Excellon / Sieb & Meyer
PCBLaser Drilling Machine (HDI)
UV / CO2 laser microvia drilling for HDI and sequential-build-up boards.
- Via Ø 50–150 µm
- UV / CO2 dual source
- HDI / SBU panels
PCBElectroless Copper Plating Line
PTH line depositing seed copper in drilled holes before electrolytic plating.
- Horizontal or vertical
- Desmear + electroless Cu
- Panel 18 × 24 in class
PCBDry Film Laminator
Hot-roll laminator applying photoresist dry film to cleaned copper surfaces.
- Film 15–50 µm
- Hot-roll, dual side
- Width to 24 in
PCBLDI Laser Direct Imaging Machine
Maskless laser imaging of inner and outer layers, replacing film artwork.
- Line / space to 25 µm
- Registration ±10 µm
- Inner / outer / SM
PCBDES Line (Developer-Etcher-Stripper)
Horizontal wet line that develops, etches and strips dry film in one pass.
- Conveyor wet process
- Alkaline / acid etch
- Inner and outer layers
PCBAOI Automated Optical Inspection
Camera AOI for inner layers, outer layers and solder mask before electrical test.
- Inner / outer / SM
- CAM netlist compare
- Defect image archive
PCBVacuum Lamination Press
Multi-opening vacuum press bonding multilayer stacks with controlled heat and pressure.
- Multi-opening platens
- Vacuum + heat/pressure
- FR-4 / high-Tg / PTFE
PCBSolder Mask Coating Machine
Screen or spray coating of liquid photoimageable solder mask onto outer layers.
- LPI screen / spray
- Dual-side coating
- IR / UV pre-cure
PCBHAL Hot Air Leveling Machine
HASL / HAL finishing that coats exposed copper with solder and levels with hot air.
- Lead-free or SnPb
- Vertical or horizontal
- IPC-6012 surface finish
PCBPCB Brushing & Cleaning Line
Mechanical brushing and chemical cleaning before dry-film lamination or solder mask.
- Pumice / brush / chemical
- Horizontal conveyor
- Pre-lam / pre-SM
CHIPSingle Crystal Pulling Furnace (CZ)
Czochralski furnace growing monocrystalline silicon ingots for wafer starting material.
- CZ pull, 6–12 in class
- Argon / vacuum chamber
- Diameter and resistivity on request
CHIPFront-End Wafer Fabrication Set
Grouped core tools for front-end wafer lines: clean handling, process modules and metrology interfaces.
- 150 / 200 / 300 mm
- Front-end process modules
- Quoted as a line package
CHIPPhysical Vapor Deposition (Sputter)
Magnetron sputter tool depositing metal and barrier films on wafers.
- Al / Cu / Ti / TiN
- Single or cluster PVD
- Wafer 150–300 mm
CHIPSilicon Ingot Wire Saw
Multi-wire saw slicing CZ ingots into wafers with controlled thickness and TTV.
- Multi-wire slurry / diamond
- Ingot 6–12 in
- TTV / warp control
CHIPWafer Lapping & Polishing Machine
Double-side lapping and CMP-style polish to bring sliced wafers to spec thickness and roughness.
- Lapping + polish
- 150 / 200 / 300 mm
- Ra / TTV to drawing
CHIPLithography Scanner / DUV·EUV Stepper
Stepper / scanner exposing wafer resist with DUV or EUV optics for critical layers.
- DUV / EUV class
- Overlay to process node
- 200 / 300 mm wafers
CHIPDry Plasma Etcher
Dry plasma etch for dielectric and metal layers with anisotropic profiles.
- RIE / ICP plasma
- Oxide / poly / metal
- Single-wafer chamber
Need a panel size, wafer diameter or process window not listed? Send the drawing or process spec — we will source and quote against it.
Capabilities
From PCB process to wafer tools
01
PCB process matching
Drilling, imaging, wet process, lamination and finishing sized to your panel, stack-up and IPC class.
02
Wafer / chip tools
CZ, slicing, polish, lithography, PVD and plasma etch quoted to wafer diameter and process node.
03
FAT & documentation
Factory acceptance, utility drawings, spare-parts lists and English operating manuals with the shipment.
04
Export logistics
Crate packing for precision tools, container loading plans and delivery schedules for line quantities.
Facility & workshop
Inside the production base
Process halls and machine bays behind every quotation for PCB and chip equipment.
Line integration
PCB wet lines and wafer tools are quoted as stand-alone machines or as grouped process packages so utilities, layout and spares arrive together.
Quality & documentation
Every tool shipped with its process file
We treat utility drawings, FAT records and spare-parts lists as part of the machine, not paperwork. Process windows are confirmed before dispatch.
- Factory acceptance test records
- Utility and layout drawings
- English manuals and training outline
- Spare-parts and consumables list
- Seaworthy crate packing
HANDOVER PACKAGE
01FAT reportRun against agreed process window
02Utility drawingPower, DI water, exhaust, CDA
03Process recipe notesPanel / wafer size, chemistry, recipe
04Packing listCrate, serial and spare-part numbers
Request a quotation
Send your process specification.
Tell us PCB or CHIP, panel / wafer size, quantity and destination. The team replies with availability, lead time and a quotation within one business day.